According to Korea Herald, Samsung has just hired a high-ranking top TSMC employee, namely Lin Jun-cheng. He worked for the Taiwanese company for about 19 years and before that, he was at Micron Technology. That's some serious background. Lin Jun-cheng will head Samsung's Advanced Packaging Team, part of the Device Solutions division, which is an essential part of developing chips. He worked on the development of 3D packaging technology for TSMC, so this might be a big hit for the Korean tech giant. Although quite capable, Samsung's Exynos chipsets for smartphones have often been...
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